MC33PF8100CFESR2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33PF8100CFESR2 Overview
Shipments can be made in the direction of Tape & Reel (TR) .For ease of transportation, it is packaged the power management in 56-VFQFN Exposed Pad .Surface Mount, Wettable Flank is a universal mounting method for easy adaptation.Among other applications, this power management targets High Performance i.MX 8, S32x Processor Based .It is recommended that the operating temperature of the power management ic be set to -40°C~105°C TA to prevent malfunctions.It works with 2.5V~5.5V voltage.The IC has been praised a lot for its capability of being a POWER SUPPLY MANAGEMENT CIRCUIT analog instruments designs.
MC33PF8100CFESR2 Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8100CFESR2 Applications
There are a lot of NXP USA Inc. MC33PF8100CFESR2Power Management applications.
- Field Service
- Switches
- Industrial/ATE
- Automotive Digital Cluster
- Telecom Rectifiers
- DDR-II Termination Voltage
- SmartPhones
- Tablet PCs
- Data Storage
- Computing
