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MC33PF8100CGES

2.5V~5.5V Specialized Power Management ICs


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-MC33PF8100CGES
  • Package: 56-VFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: 930
  • Description: 2.5V~5.5V Specialized Power Management ICs(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount, Wettable Flank
Package / Case 56-VFQFN Exposed Pad
Operating Temperature -40°C~105°C TA
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Applications High Performance i.MX 8, S32x Processor Based
Voltage - Supply 2.5V~5.5V

MC33PF8100CGES Overview


Using Tray as a shipping the power management path is acceptable.packaged the power management in 56-VFQFN Exposed Pad for ease of transportation, it is easy to transport.Surface Mount, Wettable Flank is a universal mounting method that is easy to adapt.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.The operating temperature of the power management ic should be set to -40°C~105°C TA to avoid mal-function.As a result, this power management is powered by 2.5V~5.5V voltage.

MC33PF8100CGES Features


Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA

MC33PF8100CGES Applications


There are a lot of NXP USA Inc. MC33PF8100CGESPower Management applications.

  • DSP
  • DDR2 Termination Voltage
  • Power Supplies
  • Printers
  • Set-Top-Box
  • GPS
  • Optical imaging payload
  • Docking station
  • Automotive cluster
  • In Conjunction With the Internal Feedback E/A of OEM Power Supply Units

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