Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount, Wettable Flank |
Package / Case |
56-VFQFN Exposed Pad |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tape & Reel (TR) |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
High Performance i.MX 8, S32x Processor Based |
Voltage - Supply |
2.5V~5.5V |
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC33PF8100CHESR2 Overview
Tape & Reel (TR) is acceptable for shipping the power management.For ease of transportation, it is packaged the power management in 56-VFQFN Exposed Pad .The Surface Mount, Wettable Flank mounting method facilitates easy adaptation.The power management is intended for use at High Performance i.MX 8, S32x Processor Based as well as other applications.It is recommended that you set the operating temperature of the power management ic to -40°C~105°C TA in order to prevent malfunctions.2.5V~5.5V voltage is used for the operation of this power management.The IC has been praised a lot for its capability of being a POWER SUPPLY MANAGEMENT CIRCUIT analog instruments designs.
MC33PF8100CHESR2 Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8100CHESR2 Applications
There are a lot of NXP USA Inc. MC33PF8100CHESR2Power Management applications.
- Server Backplane Systems
- SSTL-18 Termination
- Base Station Power Distribution Systems
- Chromebook
- Medical PC
- Netbooks
- Telecommunications Equipment
- Industrial Telemetry Applications
- Radar
- Applications Processors