Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount, Wettable Flank |
Package / Case |
56-VFQFN Exposed Pad |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tray |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
High Performance i.MX 8, S32x Processor Based |
Voltage - Supply |
2.7V~5.5V |
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT |
MC33PF8100ERES Overview
Using Tray as a shipping the power management path is acceptable.The package is conveniently packaged the power management in 56-VFQFN Exposed Pad .The Surface Mount, Wettable Flank mounting method allows for easy adaptation.At High Performance i.MX 8, S32x Processor Based and other applications, this power management is targeted.It is recommended that you set the operating temperature of the power management ic to -40°C~105°C TA in order to prevent malfunctions.It works with 2.7V~5.5V voltage.As a POWER SUPPLY MANAGEMENT CIRCUIT analog IC, the instruments designs has received lots of praise.
MC33PF8100ERES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8100ERES Applications
There are a lot of NXP USA Inc. MC33PF8100ERESPower Management applications.
- Computing
- SSTL-3
- FPGA
- Industrial Equipment
- LP2996A: DDR3L
- Environmental Test
- System Health Monitoring
- Hardware Monitoring for Servers
- Standard notebook PC
- Medical