MC33PF8101A0ESR2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8 Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33PF8101A0ESR2 Overview
Shipments can be made in the direction of Tape & Reel (TR) .A convenient transport package is provided in 56-VFQFN Exposed Pad .For ease of adaptability, Surface Mount, Wettable Flank is an universal mounting method.Among other applications, this power management targets High Performance i.MX 8 Processor Based .It is recommended that you set the operating temperature of the power management ic to -40°C~105°C TA in order to prevent malfunctions.The power management works at 2.5V~5.5V voltage.It has received high praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.
MC33PF8101A0ESR2 Features
Mainly used in High Performance i.MX 8 Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8101A0ESR2 Applications
There are a lot of NXP USA Inc. MC33PF8101A0ESR2Power Management applications.
- DDR Termination Voltage WHITE SPACE
- Hardware Monitoring for Servers
- Industrial applications
- System Health Prognostics
- Computing
- LTE modem
- Set-Top-Box
- FPGA, DSP Core Power
- Office Electronics
- Supplement In-Circuit Tester (ICT) Access
