MC33PF8200CLES
| Parameters | |
|---|---|
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
MC33PF8200CLES Overview
The way of Tray is acceptable for shipping the power management.A convenient transport package is provided in 56-VFQFN Exposed Pad .For easy adaptability, Surface Mount, Wettable Flank provides a universal mounting method.The power management is designed for use with applications at High Performance i.MX 8, S32x Processor Based .Ensure that the operating temperature of the power management ic is set to -40°C~105°C TA in order to prevent malfunctions.The power management works at 2.5V~5.5V voltage.
MC33PF8200CLES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
MC33PF8200CLES Applications
There are a lot of NXP USA Inc. MC33PF8200CLESPower Management applications.
- Networking Equipment
- Portable Systems
- Measurement of Point Voltages
- Docking station
- Digital Cores
- Automotive cluster
- Medical PC
- Industrial applications
- SSTL-2 WHITE SPACE
- SSTL-3 Termination
