MC33PF8200CXESR2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
MC33PF8200CXESR2 Overview
It is acceptable to ship in the direction of Tape & Reel (TR) .To facilitate transportation, it is packaged the power management in 56-VFQFN Exposed Pad .The Surface Mount, Wettable Flank mounting method facilitates easy adaptation.Applications targeting this power management include High Performance i.MX 8, S32x Processor Based and others.Keeping the operating temperature of the power management ic -40°C~105°C TA will prevent malfunctions.2.5V~5.5V voltage is used for the operation of this power management.As an analog IC with a POWER SUPPLY MANAGEMENT CIRCUIT value, the instruments designs has been widely praised.
MC33PF8200CXESR2 Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200CXESR2 Applications
There are a lot of NXP USA Inc. MC33PF8200CXESR2Power Management applications.
- System Health Monitoring
- Automotive Digital Cluster
- Computing
- Servers
- Telecom Rectifiers
- SSTL-3
- Automotive camera module
- Portable Media Players
- Networking Equipment
- Tablets
