MC33PF8200D2ES
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
MC33PF8200D2ES Overview
Shipments can be made in the direction of Tray .For ease of transportation, it is packaged the power management in 56-VFQFN Exposed Pad .For easy adaptation, Surface Mount, Wettable Flank is a universal mounting method.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~105°C TA in order to prevent malfunction.For its operation, this power management requires 2.5V~5.5V voltage.It has been praised for its accuracy as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.
MC33PF8200D2ES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200D2ES Applications
There are a lot of NXP USA Inc. MC33PF8200D2ESPower Management applications.
- HSTL Termination
- LP2996-N: DDR1 Termination Voltage
- Equipment Run-Off of Battery Backup
- Portable Navigation Devices
- Cluster
- Wireless routers
- Digital Cores
- Industrial/ATE
- Applications Processors
- Communications payload
