MC33PF8200D2ESR2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
MC33PF8200D2ESR2 Overview
Shipments can be made in the direction of Tape & Reel (TR) .Packing in 56-VFQFN Exposed Pad makes transportation convenient.For easy adaptability, Surface Mount, Wettable Flank provides a universal mounting method.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.It is recommended that you set the operating temperature of the power management ic to -40°C~105°C TA in order to prevent malfunctions.It works with 2.5V~5.5V voltage.As a POWER SUPPLY MANAGEMENT CIRCUIT analog IC, the instruments designs has received lots of praise.
MC33PF8200D2ESR2 Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200D2ESR2 Applications
There are a lot of NXP USA Inc. MC33PF8200D2ESR2Power Management applications.
- Camera Power Applications
- Tablet PCs
- Cordless Phone Base Station
- WOA
- Automotive Infotainment
- Base Station Power Distribution Systems
- LP2996A: DDR1
- Server Backplane Systems
- Port/cable adapters
- DSP
