MC33PF8200DAES
| Parameters | |
|---|---|
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
MC33PF8200DAES Overview
The way of Tray is acceptable for shipping the power management.It is packaged the power management in 56-VFQFN Exposed Pad for convenient transportation.For easy adaptability, Surface Mount, Wettable Flank provides a universal mounting method.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.Ideally, the operating temperature of the power management ic should be set to -40°C~105°C TA to avoid any malfunctions.This power management uses 2.5V~5.5V voltage for work.
MC33PF8200DAES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
MC33PF8200DAES Applications
There are a lot of NXP USA Inc. MC33PF8200DAESPower Management applications.
- Camera Power Applications
- Automotive camera module
- Portable Systems
- Applications Processors
- Surround view system ECU
- Automotive cluster
- LTE modem
- Hand-Held Systems
- System Thermal for PCs
- Telecom Rectifiers
