MC33PF8200DBESR2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
MC33PF8200DBESR2 Overview
It is acceptable to ship in the direction of Tape & Reel (TR) .In order to facilitate transportation, it is packaged the power management in 56-VFQFN Exposed Pad .The Surface Mount, Wettable Flank mounting method allows for easy adaptation.The power management is intended for use at High Performance i.MX 8, S32x Processor Based as well as other applications.It is recommended that you set the operating temperature of the power management ic to -40°C~105°C TA in order to prevent malfunctions.The power management operates at 2.5V~5.5V volts.This analog IC has received a great deal of praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog instruments designs.
MC33PF8200DBESR2 Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200DBESR2 Applications
There are a lot of NXP USA Inc. MC33PF8200DBESR2Power Management applications.
- Memory Power
- Modules With Remote-Sense Capability
- Industrial Telemetry Applications
- LTE modem
- Automotive camera module
- Automotive cluster
- LP2996A: DDR2
- SmartPhones
- Communications payload
- DDR Termination Voltage WHITE SPACE
