Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount, Wettable Flank |
Package / Case |
56-VFQFN Exposed Pad |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tray |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
High Performance i.MX 8, S32x Processor Based |
Voltage - Supply |
2.5V~5.5V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC33PF8200DEES Overview
It is acceptable to ship in the way of Tray .packaged the power management in 56-VFQFN Exposed Pad for ease of transportation, it is easy to transport.An easy-to-adapt universal mounting system is provided by Surface Mount, Wettable Flank .Among other applications, this power management targets High Performance i.MX 8, S32x Processor Based .The operating temperature of the power management ic should be set to -40°C~105°C TA to avoid mal-function.The power management operates at 2.5V~5.5V volts.As an analog IC with a POWER SUPPLY MANAGEMENT CIRCUIT value, the instruments designs has been widely praised.
MC33PF8200DEES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200DEES Applications
There are a lot of NXP USA Inc. MC33PF8200DEESPower Management applications.
- Automotive Advanced Driver Assistance System (ADAS)
- SSTL-3 Termination
- Set-Top-Box
- Surround view system ECU
- Camera Power Applications
- In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
- Switches
- Medical
- Server Backplane Systems
- FPGA