Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount, Wettable Flank |
Package / Case |
56-VFQFN Exposed Pad |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tape & Reel (TR) |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
High Performance i.MX 8, S32x Processor Based |
Voltage - Supply |
2.5V~5.5V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC33PF8200DEESR2 Overview
Tape & Reel (TR) is acceptable as a shipping the power management method.A convenient packaging is provided in the form of 56-VFQFN Exposed Pad .The Surface Mount, Wettable Flank mounting method is universal for easy adaptation.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.Ideally, the operating temperature of the power management ic should be set to -40°C~105°C TA to avoid any malfunctions.As a result, this power management is powered by 2.5V~5.5V voltage.It has received much praise because it is a POWER SUPPLY MANAGEMENT CIRCUIT analog integrated circuit.
MC33PF8200DEESR2 Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200DEESR2 Applications
There are a lot of NXP USA Inc. MC33PF8200DEESR2Power Management applications.
- Networking Equipment
- LP2996A: DDR3L
- Projection Mapping
- Computing
- Laser TV
- Hearing Aids
- Real-time Signal Monitoring
- SSTL-2 WHITE SPACE
- In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
- System Thermal for Servers