MC33PF8200DFES
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33PF8200DFES Overview
Tray is acceptable for shipping the power management.In order to facilitate transportation, it is packaged the power management in 56-VFQFN Exposed Pad .The Surface Mount, Wettable Flank mounting method allows for easy adaptation.It targets applications such as High Performance i.MX 8, S32x Processor Based and others.It is recommended that the operating temperature of the power management ic be set to -40°C~105°C TA to prevent malfunctions.The power management operates at 2.5V~5.5V volts.The instruments designs is highly regarded as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.
MC33PF8200DFES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200DFES Applications
There are a lot of NXP USA Inc. MC33PF8200DFESPower Management applications.
- Portable Media Players
- Communications payload
- Memory Power
- FPGA, DSP Core Power
- Standard notebook PC
- SSTL-2 Termination
- Data Storage
- Isolated DC-DC Modules
- Office Electronics
- Motherboard
