MC33PF8200DFESR2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33PF8200DFESR2 Overview
The way of Tape & Reel (TR) is acceptable for shipping the power management.It is packaged the power management in 56-VFQFN Exposed Pad for convenient transportation.Surface Mount, Wettable Flank is a universal mounting method that is easy to adapt.Applications targeting this power management include High Performance i.MX 8, S32x Processor Based and others.Ideally, the operating temperature of the power management ic should be set at -40°C~105°C TA in order to prevent malfunction.2.5V~5.5V voltage is used for the operation of this power management.This analog IC has received a great deal of praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog instruments designs.
MC33PF8200DFESR2 Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200DFESR2 Applications
There are a lot of NXP USA Inc. MC33PF8200DFESR2Power Management applications.
- FPGA
- Industrial applications
- Automotive Navigation Systems
- Chromebook
- Hand-Held Systems
- DSP
- Wireless routers
- Netbooks
- Printers
- Electronic Test Equipment
