MC33PF8200DGES
| Parameters | |
|---|---|
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
MC33PF8200DGES Overview
Tray is an acceptable method of shipping the power management.A convenient transport package is provided in 56-VFQFN Exposed Pad .Surface Mount, Wettable Flank is a universal mounting method for easy adaptation.It targets applications such as High Performance i.MX 8, S32x Processor Based and others.It is recommended that the operating temperature of the power management ic be set to -40°C~105°C TA in order to prevent malfunction.The power management works at 2.5V~5.5V voltage.
MC33PF8200DGES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
MC33PF8200DGES Applications
There are a lot of NXP USA Inc. MC33PF8200DGESPower Management applications.
- Base Station Power Distribution Systems
- Automotive display
- Equipment Run-Off of Battery Backup
- Office Electronics
- Chromebook
- Electronic Test Equipment
- Telecommunication
- LP2996A: DDR3L
- Switches
- Industrial Equipment
