MC33PF8200DHES
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
MC33PF8200DHES Overview
The way of Tray is acceptable for shipping the power management.packaged the power management in 56-VFQFN Exposed Pad for ease of transportation, it is easy to transport.An easy-to-adapt universal mounting system is provided by Surface Mount, Wettable Flank .The power management is designed for use with applications at High Performance i.MX 8, S32x Processor Based .It is recommended that you set the operating temperature of the power management ic to -40°C~105°C TA in order to prevent malfunctions.It works with 2.5V~5.5V voltage.The instruments designs has received high praise because it is an analog POWER SUPPLY MANAGEMENT CIRCUIT IC.
MC33PF8200DHES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200DHES Applications
There are a lot of NXP USA Inc. MC33PF8200DHESPower Management applications.
- Automotive camera module
- Servers
- DSP
- Cordless Phone Base Station
- Tablet PCs
- Radar
- FPGA
- Communications payload
- Portable Systems
- Space satellite point of load supply
