MC33PF8200EMES
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33PF8200EMES Overview
The way of Tray is acceptable for shipping the power management.Packing in 56-VFQFN Exposed Pad makes transportation convenient.An easy-to-adapt universal mounting system is provided by Surface Mount, Wettable Flank .At High Performance i.MX 8, S32x Processor Based and other applications, this power management is targeted.Ensure that the operating temperature of the power management ic is set to -40°C~105°C TA in order to prevent malfunctions.As a result, this power management is powered by 2.5V~5.5V voltage.It has received much praise because it is a POWER SUPPLY MANAGEMENT CIRCUIT analog integrated circuit.
MC33PF8200EMES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200EMES Applications
There are a lot of NXP USA Inc. MC33PF8200EMESPower Management applications.
- Tablets
- Automotive Navigation Systems
- Digital Cores
- FPGA
- Office Electronics
- Portable Systems
- Cordless Phone Base Station
- Set-Top-Box
- Hand-Held Systems
- Automotive head unit
