Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount, Wettable Flank |
Package / Case |
56-VFQFN Exposed Pad |
Operating Temperature |
-40°C~105°C TA |
Packaging |
Tape & Reel (TR) |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
High Performance i.MX 8, S32x Processor Based |
Voltage - Supply |
2.5V~5.5V |
Analog IC - Other Type |
POWER SUPPLY MANAGEMENT CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC33PF8200EMESR2 Overview
It is acceptable to ship in the direction of Tape & Reel (TR) .For ease of transportation, it is packaged the power management in 56-VFQFN Exposed Pad .The Surface Mount, Wettable Flank mounting method facilitates easy adaptation.It is intended to be used at High Performance i.MX 8, S32x Processor Based as well as for other applications.The operating temperature of the power management ic should be set to -40°C~105°C TA to avoid mal-function.The power management operates at a voltage of 2.5V~5.5V volts.The instruments designs has received high praise because it is an analog POWER SUPPLY MANAGEMENT CIRCUIT IC.
MC33PF8200EMESR2 Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200EMESR2 Applications
There are a lot of NXP USA Inc. MC33PF8200EMESR2Power Management applications.
- Networking Equipment
- System Thermal for PCs
- Storage Systems
- LP2996-N: DDR1 Termination Voltage
- Netbooks
- SSTL-2 WHITE SPACE
- Debug
- Isolated DC-DC Modules
- Automotive head unit
- Automotive display