MC33PF8200ESESR2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33PF8200ESESR2 Overview
Shipments can be made in the direction of Tape & Reel (TR) .The package is conveniently packaged the power management in 56-VFQFN Exposed Pad .The Surface Mount, Wettable Flank mounting method is universal for easy adaptation.At High Performance i.MX 8, S32x Processor Based and other applications, this power management is targeted.A temperature setting of -40°C~105°C TA is recommended to avoid malfunctions.The power management operates at 2.5V~5.5V volts.It has received high praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.
MC33PF8200ESESR2 Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200ESESR2 Applications
There are a lot of NXP USA Inc. MC33PF8200ESESR2Power Management applications.
- Printers
- Automotive camera module
- Industrial applications
- Computing
- Server Backplane Systems
- Industrial Equipment
- Portable Media Players
- Hearing Aids
- Electronic Test Equipment
- Digital Cores
