MC33PF8200ETES
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.7V~5.5V |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
MC33PF8200ETES Overview
It is acceptable to ship using the method Tray .It is packaged the power management in 56-VFQFN Exposed Pad for ease of transportation.For ease of adaptability, Surface Mount, Wettable Flank is an universal mounting method.This power management targets at High Performance i.MX 8, S32x Processor Based and other applications.It is recommended that you set the operating temperature of the power management ic to -40°C~105°C TA in order to prevent malfunctions.The power management operates at 2.7V~5.5V volts.It has received much praise because it is a POWER SUPPLY MANAGEMENT CIRCUIT analog integrated circuit.
MC33PF8200ETES Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8200ETES Applications
There are a lot of NXP USA Inc. MC33PF8200ETESPower Management applications.
- Port/cable adapters
- Radar system ECU
- Automotive Advanced Driver Assistance System (ADAS)
- Server Backplane Systems
- Chromebook
- Switches
- LP2996A: DDR3
- Digital Signage
- Termination Voltage
- Industrial PC
