MC33PF8201A0ESR2
| Parameters | |
|---|---|
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8 Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount, Wettable Flank |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
MC33PF8201A0ESR2 Overview
The way of Tape & Reel (TR) is acceptable for shipping the power management.In order to facilitate transportation, it is packaged the power management in 56-VFQFN Exposed Pad .Surface Mount, Wettable Flank is a universal mounting method that is easy to adapt.Applications targeting this power management include High Performance i.MX 8 Processor Based and others.Ensure that the operating temperature of the power management ic is set to -40°C~105°C TA in order to prevent malfunctions.As a result, this power management is powered by 2.5V~5.5V voltage.It has received high praise as a POWER SUPPLY MANAGEMENT CIRCUIT analog IC.
MC33PF8201A0ESR2 Features
Mainly used in High Performance i.MX 8 Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC33PF8201A0ESR2 Applications
There are a lot of NXP USA Inc. MC33PF8201A0ESR2Power Management applications.
- Printers
- System Thermal for Servers
- HSTL Termination
- FPGA
- Hearing Aids
- Hand-Held Systems
- System Health Monitoring
- Projection Mapping
- Radar system ECU
- Chromebook
