MC34PF8100CHEP
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT |
MC34PF8100CHEP Overview
Ready for shipping the power management in Tray package.It is packaged the power management in 56-VFQFN Exposed Pad for convenient transportation.For ease of adaptability, Surface Mount is an universal mounting method.The power management is intended for use at High Performance i.MX 8, S32x Processor Based as well as other applications.Ideally, the operating temperature of the power management ic should be set at -40°C~105°C TA in order to prevent malfunction.For its operation, this power management requires 2.5V~5.5V voltage.It has received much praise because it is a POWER SUPPLY MANAGEMENT CIRCUIT analog integrated circuit.
MC34PF8100CHEP Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
POWER SUPPLY MANAGEMENT CIRCUIT analog IC
MC34PF8100CHEP Applications
There are a lot of NXP USA Inc. MC34PF8100CHEPPower Management applications.
- Production Test
- DDR Termination Voltage WHITE SPACE
- Motherboard
- Field Service
- Supplement In-Circuit Tester (ICT) Access
- Applications Processors
- Hardware Monitoring for Servers
- Projection Mapping
- Printers
- I/Os (FPGAs, ASICs, DSPs)
