MC34PF8100EQEPR2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 56-VFQFN Exposed Pad |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tape & Reel (TR) |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Voltage - Supply | 2.5V~5.5V |
| RoHS Status | ROHS3 Compliant |
MC34PF8100EQEPR2 Overview
It is acceptable to ship in the way of Tape & Reel (TR) .The package is conveniently packaged the power management in 56-VFQFN Exposed Pad .For ease of adaptability, Surface Mount is an universal mounting method.The power management is targeted at High Performance i.MX 8, S32x Processor Based and other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~105°C TA to prevent malfunctions.This power management uses 2.5V~5.5V voltage for work.
MC34PF8100EQEPR2 Features
Mainly used in High Performance i.MX 8, S32x Processor Based applications
Operating temperature: -40°C~105°C TA
MC34PF8100EQEPR2 Applications
There are a lot of NXP USA Inc. MC34PF8100EQEPR2Power Management applications.
- Isolated DC-DC Modules
- Computing
- Telecommunications Equipment
- Industrial applications
- Digital Cores
- Automotive head unit
- HSTL Termination
- Port/cable adapters
- Field Service
- Peripheral I/O Power
