MC35FS4501CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS4501CAE Overview
Tray is acceptable as a shipping the power management method.To facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .For easy adaptability, Surface Mount provides a universal mounting method.Among other applications, this power management targets System Basis Chip .Ensure that the operating temperature of the power management ic is set to -40°C~150°C TA in order to prevent malfunctions.The power management works at 1V~5V voltage.There are a manage ics from Automotive, AEC-Q100 .
MC35FS4501CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS4501CAE Applications
There are a lot of NXP USA Inc. MC35FS4501CAEPower Management applications.
- In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
- Projection Mapping
- Desktop PC
- Automotive Navigation Systems
- Computing
- Hand-Held Systems
- Set-Top-Box
- HSTL Termination
- Electronic Test Equipment
- Optical imaging payload
