MC35FS4501NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS4501NAE Overview
The way of Tray is acceptable for shipping the power management.For ease of transportation, it is packaged the power management in 48-LQFP Exposed Pad .For ease of adaptability, Surface Mount is an universal mounting method.Applications targeting this power management include System Basis Chip and others.Ideally, the operating temperature of the power management ic should be set to -40°C~150°C TA to avoid any malfunctions.The power management runs on 1V~5V voltage.The manage ics belongs to Automotive, AEC-Q100 series.
MC35FS4501NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS4501NAE Applications
There are a lot of NXP USA Inc. MC35FS4501NAEPower Management applications.
- Port/cable dongles
- Automotive Advanced Driver Assistance System (ADAS)
- Port/cable adapters
- Storage Systems
- Supplement In-Circuit Tester (ICT) Access
- GPS
- Printers
- Portable Systems
- Production Test
- In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
