MC35FS4502CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS4502CAE Overview
Tray is acceptable as a shipping the power management method.packaged the power management in 48-LQFP Exposed Pad for ease of transportation, it is easy to transport.The Surface Mount mounting method facilitates easy adaptation.It is intended to be used at System Basis Chip as well as for other applications.Ensure that the operating temperature of the power management ic is set to -40°C~150°C TA in order to prevent malfunctions.1V~5V voltage is used for the operation of this power management.Thare manage ics are based on Automotive, AEC-Q100 series.
MC35FS4502CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS4502CAE Applications
There are a lot of NXP USA Inc. MC35FS4502CAEPower Management applications.
- LP2996A: DDR1
- Digital Cores
- Automotive camera module
- Field Service
- SSTL-2 Termination
- 4K Ultra High Definition (UHD) Display
- Peripheral I/O Power
- Automotive Advanced Driver Assistance System (ADAS)
- Termination Voltage
- Data Storage
