MC35FS4503NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS4503NAE Overview
It is acceptable to ship using the method Tray .To facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .The Surface Mount mounting method is universal for easy adaptation.The power management is targeted at System Basis Chip and other applications.Ideally, the operating temperature of the power management ic should be set to -40°C~150°C TA to avoid any malfunctions.It works with 1V~5V voltage.The manage ics belongs to Automotive, AEC-Q100 series.
MC35FS4503NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS4503NAE Applications
There are a lot of NXP USA Inc. MC35FS4503NAEPower Management applications.
- LP2996A: DDR1
- Portable Systems
- Port/cable adapters
- System Thermal for PCs
- Netbooks
- Hardware Monitoring for Servers
- SSTL-3
- SmartPhones
- Hand-Held Systems
- SSTL-2 WHITE SPACE
