MC35FS6500CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6500CAE Overview
Shipments can be made in the direction of Tray .The package is conveniently packaged the power management in 48-LQFP Exposed Pad .An easy-to-adapt universal mounting system is provided by Surface Mount .The power management is designed for use with applications at System Basis Chip .Ensure that the operating temperature of the power management ic is set to -40°C~150°C TA in order to prevent malfunctions.For its operation, the power management uses 1V~5V voltage.Automotive, AEC-Q100 can be used to search for similar manage icss.
MC35FS6500CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6500CAE Applications
There are a lot of NXP USA Inc. MC35FS6500CAEPower Management applications.
- Tablets
- DSP
- Cluster
- Peripheral I/O Power
- DDR2 Termination Voltage
- Supplement In-Circuit Tester (ICT) Access
- Desktop PC
- Camera Power Applications
- FPGA
- Automotive Navigation Systems
