MC35FS6501CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6501CAE Overview
Tray is acceptable for shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for ease of transportation.The Surface Mount mounting method facilitates easy adaptation.This power management targets at System Basis Chip and other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~150°C TA to prevent malfunctions.For its operation, the power management uses 1V~5V voltage.There are a manage ics from Automotive, AEC-Q100 .
MC35FS6501CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6501CAE Applications
There are a lot of NXP USA Inc. MC35FS6501CAEPower Management applications.
- Standard notebook PC
- Industrial PC
- SSTL-2 WHITE SPACE
- DDR2 Termination Voltage
- Debug
- Tablet PCs
- Electronic Test Equipment
- Camera Power Applications
- Radar system ECU
- Production Test
