MC35FS6501CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tape & Reel (TR) |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6501CAER2 Overview
Ready for shipping the power management in Tape & Reel (TR) package.For ease of transportation, it is packaged the power management in 48-LQFP Exposed Pad .For ease of adaptability, Surface Mount is an universal mounting method.It targets applications such as System Basis Chip and others.The operating temperature of the power management ic should be set to -40°C~150°C TA to avoid mal-function.For its operation, this power management requires 1V~5V voltage.Thare manage ics are based on Automotive, AEC-Q100 series.
MC35FS6501CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6501CAER2 Applications
There are a lot of NXP USA Inc. MC35FS6501CAER2Power Management applications.
- FPGA
- Real-time Signal Monitoring
- Storage Systems
- Wireless routers
- Automotive Infotainment
- Telecommunications Equipment
- Measurement of Point Voltages
- System Thermal for Servers
- Port/cable adapters
- Telecommunication
