MC35FS6501NAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tape & Reel (TR) |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6501NAER2 Overview
The way of Tape & Reel (TR) is acceptable for shipping the power management.A convenient transport package is provided in 48-LQFP Exposed Pad .The Surface Mount mounting method facilitates easy adaptation.The power management is designed for use with applications at System Basis Chip .To ensure proper functioning, the operating temperature of the power management ic should be set to -40°C~150°C TA .The power management runs on 1V~5V voltage.It are possible to search for similar manage icss based on Automotive, AEC-Q100 .
MC35FS6501NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6501NAER2 Applications
There are a lot of NXP USA Inc. MC35FS6501NAER2Power Management applications.
- Industrial Equipment
- Radar
- Portable Media Players
- SmartPhones
- SSTL-2 WHITE SPACE
- Production Test
- Hardware Monitoring for PCs
- Applications Processors
- Real-time Signal Monitoring
- System Health Monitoring
