MC35FS6502CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6502CAE Overview
Tray is an acceptable method of shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.An easy-to-adapt universal mounting system is provided by Surface Mount .Among other applications, this power management targets System Basis Chip .Ideally, the operating temperature of the power management ic should be set at -40°C~150°C TA in order to prevent malfunction.The power management works at 1V~5V voltage.It comes from Automotive, AEC-Q100 .
MC35FS6502CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6502CAE Applications
There are a lot of NXP USA Inc. MC35FS6502CAEPower Management applications.
- Storage Systems
- Radar system ECU
- Projection Mapping
- DDR Termination Voltage WHITE SPACE
- Supplement In-Circuit Tester (ICT) Access
- Portable Navigation Devices
- Automotive camera module
- System Health Monitoring
- Standard notebook PC
- Surround view system ECU
