Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
48-LQFP Exposed Pad |
Operating Temperature |
-40°C~150°C TA |
Packaging |
Tape & Reel (TR) |
Series |
Automotive, AEC-Q100 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
System Basis Chip |
Voltage - Supply |
1V~5V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Telecom IC Type |
INTERFACE CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC35FS6502CAER2 Overview
It is acceptable to ship in the direction of Tape & Reel (TR) .In order to facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.Among other applications, this power management targets System Basis Chip .Ensure that the operating temperature of the power management ic is set to -40°C~150°C TA in order to prevent malfunctions.This power management uses 1V~5V voltage for work.The manage ics belongs to Automotive, AEC-Q100 series.
MC35FS6502CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6502CAER2 Applications
There are a lot of NXP USA Inc. MC35FS6502CAER2Power Management applications.
- Wireless routers
- Digital Signage
- Hearing Aids
- Office Electronics
- GPS
- Cordless Phone Base Station
- Industrial/ATE
- I/Os (FPGAs, ASICs, DSPs)
- Tablets
- Digital Cores