MC35FS6502NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6502NAE Overview
Tray is acceptable as a shipping the power management method.To facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.The power management is designed for use with applications at System Basis Chip .It is recommended that the operating temperature of the power management ic be set to -40°C~150°C TA in order to prevent malfunction.1V~5V voltage is used for the operation of this power management.The manage ics are from Automotive, AEC-Q100 .
MC35FS6502NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6502NAE Applications
There are a lot of NXP USA Inc. MC35FS6502NAEPower Management applications.
- LP2996-N: DDR1 Termination Voltage
- Storage Systems
- Telecommunication
- 4K Ultra High Definition (UHD) Display
- Camera Power Applications
- Peripheral I/O Power
- System Health Prognostics
- SSTL-3
- Automotive Advanced Driver Assistance System (ADAS)
- Communications payload
