MC35FS6502NAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tape & Reel (TR) |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6502NAER2 Overview
Shipments can be made in the direction of Tape & Reel (TR) .Packing in 48-LQFP Exposed Pad makes transportation convenient.The Surface Mount mounting method facilitates easy adaptation.Among other applications, this power management targets System Basis Chip .Ideally, the operating temperature of the power management ic should be set to -40°C~150°C TA to avoid any malfunctions.The power management runs on 1V~5V voltage.The manage ics belongs to Automotive, AEC-Q100 series.
MC35FS6502NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6502NAER2 Applications
There are a lot of NXP USA Inc. MC35FS6502NAER2Power Management applications.
- Equipment Run-Off of Battery Backup
- LP2996A: DDR1
- DDR-II Termination Voltage
- Space satellite point of load supply
- FPGA
- Telecommunication
- Wireless routers
- Cluster
- Switches
- Power Factor Correction
