MC35FS6503CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6503CAE Overview
Tray is acceptable for shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.The Surface Mount mounting method is universal for easy adaptation.The power management is intended for use at System Basis Chip as well as other applications.A temperature setting of -40°C~150°C TA is recommended to avoid malfunctions.It works with 1V~5V voltage.It comes from Automotive, AEC-Q100 .
MC35FS6503CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6503CAE Applications
There are a lot of NXP USA Inc. MC35FS6503CAEPower Management applications.
- Data Storage
- Modules With Remote-Sense Capability
- SmartPhones
- Electronic Test Instrumentation
- Measurement of Point Voltages
- Base Station Power Distribution Systems
- Automotive head unit
- Memory Power
- SSTL-2 Termination
- SSTL-2 WHITE SPACE
