MC35FS6503NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6503NAE Overview
The way of Tray is acceptable for shipping the power management.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.Surface Mount is an universal mounting way for easy adapting.Applications targeting this power management include System Basis Chip and others.It is recommended that you set the operating temperature of the power management ic to -40°C~150°C TA in order to prevent malfunctions.As a result, this power management is powered by 1V~5V voltage.The manage ics are from Automotive, AEC-Q100 .
MC35FS6503NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6503NAE Applications
There are a lot of NXP USA Inc. MC35FS6503NAEPower Management applications.
- Hardware Monitoring for PCs
- Radar system ECU
- Termination Voltage
- Real-time Signal Monitoring
- Environmental Test
- Automotive head unit
- Automotive Infotainment
- FPGA, DSP Core Power
- Peripheral I/O Power
- Set-Top-Box
