MC35FS6503NAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tape & Reel (TR) |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6503NAER2 Overview
The way of Tape & Reel (TR) is acceptable for shipping the power management.For ease of transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is an universal mounting way for easy adapting.The power management is designed for use with applications at System Basis Chip .A temperature setting of -40°C~150°C TA is recommended to avoid malfunctions.The power management operates at a voltage of 1V~5V volts.There are a manage ics from Automotive, AEC-Q100 .
MC35FS6503NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6503NAER2 Applications
There are a lot of NXP USA Inc. MC35FS6503NAER2Power Management applications.
- Projection Mapping
- Portable Navigation Devices
- Desktop PC
- Portable Systems
- Networking Router
- FPGA, DSP Core Power
- Industrial PC
- Base Station Power Distribution Systems
- Automotive camera module
- Server Backplane Systems
