MC35FS6510CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6510CAE Overview
It is acceptable to ship in the direction of Tray .For ease of transportation, it is packaged the power management in 48-LQFP Exposed Pad .The Surface Mount mounting method is universal for easy adaptation.At System Basis Chip and other applications, this power management is targeted.A temperature setting of -40°C~150°C TA is recommended to avoid malfunctions.The power management operates at a voltage of 1V~5V volts.There are a manage ics from Automotive, AEC-Q100 .
MC35FS6510CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6510CAE Applications
There are a lot of NXP USA Inc. MC35FS6510CAEPower Management applications.
- Medical PC
- Industrial applications
- System Thermal for PCs
- SSTL-2 WHITE SPACE
- Hardware Monitoring for PCs
- Switches
- Automotive cluster
- Hand-Held Systems
- SSTL-3
- Industrial Equipment
