MC35FS6510CAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tape & Reel (TR) |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6510CAER2 Overview
The way of Tape & Reel (TR) is acceptable for shipping the power management.A convenient packaging is provided in the form of 48-LQFP Exposed Pad .The Surface Mount mounting method allows for easy adaptation.This power management targets at System Basis Chip and other applications.It is recommended that the operating temperature of the power management ic be set to -40°C~150°C TA to prevent malfunctions.This power management uses 1V~5V voltage for work.It is based on the series Automotive, AEC-Q100 .
MC35FS6510CAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6510CAER2 Applications
There are a lot of NXP USA Inc. MC35FS6510CAER2Power Management applications.
- DSP
- Cordless Phone Base Station
- FPGA, DSP Core Power
- System Health Prognostics
- Portable Navigation Devices
- Telecommunications Equipment
- Supplement In-Circuit Tester (ICT) Access
- Networking Equipment
- LP2996A: DDR2
- Measurement of Point Voltages
