Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
48-LQFP Exposed Pad |
Operating Temperature |
-40°C~150°C TA |
Packaging |
Tray |
Series |
Automotive, AEC-Q100 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Applications |
System Basis Chip |
Voltage - Supply |
1V~5V |
Peak Reflow Temperature (Cel) |
260 |
Time@Peak Reflow Temperature-Max (s) |
40 |
Telecom IC Type |
INTERFACE CIRCUIT |
RoHS Status |
ROHS3 Compliant |
MC35FS6510NAE Overview
Tray is an acceptable method of shipping the power management.In order to facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method that is easy to adapt.The power management is targeted at System Basis Chip and other applications.Keeping the operating temperature of the power management ic -40°C~150°C TA will prevent malfunctions.The power management runs on 1V~5V voltage.The manage ics are based on the Automotive, AEC-Q100 series.
MC35FS6510NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6510NAE Applications
There are a lot of NXP USA Inc. MC35FS6510NAEPower Management applications.
- 4K Ultra High Definition (UHD) Display
- Chromebook
- Telecommunications Equipment
- Production Test
- SmartPhones
- Optical imaging payload
- Applications Processors
- Servers
- Debug
- Termination Voltage