MC35FS6511NAER2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tape & Reel (TR) |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6511NAER2 Overview
Ready for shipping the power management in Tape & Reel (TR) package.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.The Surface Mount mounting method facilitates easy adaptation.Among other applications, this power management targets System Basis Chip .It is recommended that the operating temperature of the power management ic be set to -40°C~150°C TA in order to prevent malfunction.For its operation, this power management requires 1V~5V voltage.It is based on the series Automotive, AEC-Q100 .
MC35FS6511NAER2 Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6511NAER2 Applications
There are a lot of NXP USA Inc. MC35FS6511NAER2Power Management applications.
- Environmental Test
- DDR2 Termination Voltage
- Automotive Infotainment
- Medical
- FPGA
- Desktop PC
- SSTL-18 Termination
- FPGA
- Port/cable dongles
- Hardware Monitoring for Servers
