MC35FS6512NAE
| Parameters | |
|---|---|
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
MC35FS6512NAE Overview
Shipments can be made in the direction of Tray .In order to facilitate transportation, it is packaged the power management in 48-LQFP Exposed Pad .The Surface Mount mounting method is universal for easy adaptation.At System Basis Chip and other applications, this power management is targeted.Keeping the operating temperature of the power management ic -40°C~150°C TA will prevent malfunctions.For its operation, the power management uses 1V~5V voltage.There are a manage ics from Automotive, AEC-Q100 .
MC35FS6512NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6512NAE Applications
There are a lot of NXP USA Inc. MC35FS6512NAEPower Management applications.
- LP2996A: DDR2
- System Thermal for Servers
- Digital Signage
- Industrial PC
- SSTL-2 Termination
- Networking Router
- Field Service
- Portable Systems
- Radar
- Supplement In-Circuit Tester (ICT) Access
