MC35FS6513CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6513CAE Overview
Tray is acceptable for shipping the power management.A convenient transport package is provided in 48-LQFP Exposed Pad .The Surface Mount mounting method allows for easy adaptation.Applications targeting this power management include System Basis Chip and others.Ideally, the operating temperature of the power management ic should be set at -40°C~150°C TA in order to prevent malfunction.For its operation, the power management uses 1V~5V voltage.It is based on the series Automotive, AEC-Q100 .
MC35FS6513CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6513CAE Applications
There are a lot of NXP USA Inc. MC35FS6513CAEPower Management applications.
- DSP
- Electronic Test Equipment
- Industrial Telemetry Applications
- Automotive head unit
- FPGA, DSP Core Power
- I/Os (FPGAs, ASICs, DSPs)
- Networking Equipment
- SSTL-3 Termination
- Environmental Test
- SSTL-18 Termination
