MC35FS6513NAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~150°C TA |
| Packaging | Tray |
| Series | Automotive, AEC-Q100 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC35FS6513NAE Overview
Shipments can be made in the direction of Tray .The package is conveniently packaged the power management in 48-LQFP Exposed Pad .Surface Mount is a universal mounting method for easy adaptation.It is intended to be used at System Basis Chip as well as for other applications.A temperature setting of -40°C~150°C TA is recommended to avoid malfunctions.This power management uses 1V~5V voltage for work.It are possible to search for similar manage icss based on Automotive, AEC-Q100 .
MC35FS6513NAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~150°C TA
MC35FS6513NAE Applications
There are a lot of NXP USA Inc. MC35FS6513NAEPower Management applications.
- FPGA
- Switches
- System Thermal for PCs
- Projection Mapping
- Field Service
- FPGA, DSP Core Power
- Wireless routers
- Telecommunications Equipment
- Modules With Remote-Sense Capability
- Memory Power
