Parameters |
Package / Case |
132-BQFP Bumpered |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tape & Reel (TR) |
Published |
1995 |
Series |
M683xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
HTS Code |
8542.31.00.01 |
Technology |
CMOS |
Terminal Position |
UNSPECIFIED |
Terminal Form |
UNSPECIFIED |
Supply Voltage |
5V |
Base Part Number |
MC68302 |
Supply Voltage-Max (Vsup) |
5.5V |
Supply Voltage-Min (Vsup) |
4.5V |
Speed |
20MHz |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Core Processor |
M68000 |
Voltage - I/O |
5.0V |
Number of Cores/Bus Width |
1 Core 8/16-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
GCI, IDL, ISDN, NMSI, PCM, SCPI |
Co-Processors/DSP |
Communications; RISC CPM |
RoHS Status |
ROHS3 Compliant |
MC68302EH20CR2 Overview
The microprocessor is convenient for international shipping since it is packaged in 132-BQFP Bumpered. High reliability is provided by the advanced packaging method Tape & Reel (TR). 1 Core 8/16-Bit cores/Bus width are present in the CPU. It is important to understand the operating temperature around 0°C~70°C TA. This is a member of the M683xx series. M68000 is the processor core of this CPU. DRAM RAM controllers are used by this CPU. Featuring GCI, IDL, ISDN, NMSI, PCM, SCPI interfaces, this microprocessor can better serve you. The CPU runs at 5.0V when it comes to I/O. In terms of uPs and uCs as well as peripheral ICs, this is a MICROPROCESSOR CIRCUIT. Try searching for variants of the cpu microprocessor with MC68302. In the case of a 5V voltage supply, the embedded microprocessor should be turned on and run. The supply voltage should not exceed 5.5V.
MC68302EH20CR2 Features
M68000 Core
MC68302EH20CR2 Applications
There are a lot of NXP USA Inc. MC68302EH20CR2 Microprocessor applications.
- Printers
- Nintendo
- Robotic prosthetic limbs
- Kindle
- Metering & measurement field
- Scanners
- Process control devices
- Laminators
- Xbox
- Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)