Parameters |
RAM Controllers |
DRAM |
Additional Interfaces |
SCC, SMC, SPI |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
Package / Case |
357-BGA |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tape & Reel (TR) |
Published |
1995 |
Series |
M683xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MC68360 |
Speed |
25MHz |
Core Processor |
CPU32+ |
Voltage - I/O |
5.0V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
MC68360ZP25LR2 Overview
The microprocessor is conveniently packaged in 357-BGA, making it easy to ship internationally. High reliability can be achieved by using the advanced packaging method Tape & Reel (TR). Cores/Bus width of the CPU is 1 Core 32-Bit . It is important to understand the operating temperature around 0°C~70°C TA. In the series M683xx, it is found. The CPU is powered by a CPU32+ core. A CPU with this architecture uses DRAM RAM controllers. This microprocessor has SCC, SMC, SPI interfaces to serve you better. There is 5.0V I/O running on this CPU. If you are looking for variants of the cpu microprocessor, try search with MC68360.
MC68360ZP25LR2 Features
CPU32+ Core
MC68360ZP25LR2 Applications
There are a lot of NXP USA Inc. MC68360ZP25LR2 Microprocessor applications.
- Fabric
- Computer/laptop
- Smartphone
- Fax machines
- 3D printers
- Mice
- Communication-bluetooth, Wi-Fi, radio
- Speed meter
- Guidance-GPS
- Broadband technology, video and voice processing