Parameters |
Package / Case |
357-BGA |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tray |
Published |
1995 |
Series |
M683xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MC68EN360 |
Speed |
25MHz |
Core Processor |
CPU32+ |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
SCC, SMC, SPI |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
MC68EN360ZP25VL Overview
Packed in 357-BGA, the microprocessor is convenient for shipping overseas. Using advanced packaging techniques Tray, high reliability is ensured. There are 1 Core 32-Bit cores per bus width on the CPU. It is important to understand the operating temperature around 0°C~70°C TA. In the series M683xx, it is found. CPU32+ processors are embedded in this CPU. DRAM RAM controllers are used by this CPU. The microprocessor features interfaces SCC, SMC, SPI for better service. I/O is run at 3.3V on this CPU. Try searching for variants of the cpu microprocessor with MC68EN360.
MC68EN360ZP25VL Features
CPU32+ Core
MC68EN360ZP25VL Applications
There are a lot of NXP USA Inc. MC68EN360ZP25VL Microprocessor applications.
- Fabric
- Christmas lights
- Wastewater treatment
- Telephone sets
- Safety field
- Hearing aids
- Electrocardiogram (EKG)
- Communication-bluetooth, Wi-Fi, radio
- Industrial robot
- Smart instruments