Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tape & Reel (TR) |
Published |
1995 |
Series |
M683xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MC68EN360 |
Speed |
25MHz |
Core Processor |
CPU32+ |
Voltage - I/O |
5.0V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
SCC, SMC, SPI |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
MC68EN360ZQ25LR2 Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 357-BBGA. Advanced packaging method Tape & Reel (TR) is used to provide high reliability. CPUs have 1 Core 32-Bit cores/bus width. It is important to understand the operating temperature around 0°C~70°C TA. The M683xx series contains it. The CPU is powered by a CPU32+ core. The CPU uses DRAM RAM controllers. This microprocessor features SCC, SMC, SPI interfaces to better serve its users. In this CPU, I/O is set to 5.0V. Search MC68EN360 for variants of the embedded microprocessor.
MC68EN360ZQ25LR2 Features
CPU32+ Core
MC68EN360ZQ25LR2 Applications
There are a lot of NXP USA Inc. MC68EN360ZQ25LR2 Microprocessor applications.
- Petrochemical
- Refrigerators
- Electrocardiogram (EKG)
- Home appliances
- Hand-held metering systems
- Monitoring-temperature level, oil level, speed, distance, acceleration
- Mice
- Virtual reality VR robots
- Glucose monitoring systems (for Type 1 Diabetes)
- Microwave ovens